Chemically Enhanced Polishing (CEP) Technology for Semiconductor Manufacturing

Introduction

Korean leading electronics company offers advanced chemically enhanced polishing (CEP) technology for manufacturing of semiconductors. The CEP process replaces the conventional CMP technology that has a number of shortcomings, including low polishing rate; poor uniformity and reproducibility; air exposure of slurry supply system; polishing with back-surface reference; and difficulty with in-situ monitoring. This new technology demonstrated better results compared with conventional CMP process in tests with Tungsten plug. The removal rate uniformity of CEP process is well controlled by rotation speed and location of injection nozzle. No damage on alignment key, that is a frequent problem with CMP, is observed in the CEP process.

Area of Application

Planarization process of semiconductor manufacturing.

Advantages

Economic, high productivity planarization technology Good process controllability High throughput process yields Improved local and global planarization No post-CEP cleaning required No consumables other than chemicals Low cost of equipment Co

Development Status

Commercialised

For further information please contact

Asian and Pacific Centre for Transfer of Technology
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